AOI金线检测机用于检测封装芯片上的金线连接质量和准确性。使用高分辨率2D/3D相机和AI图像处理算法，对封装芯片上的金线连接进行快速、精确的检测和分析。能够检测金线的焊接情况、位置、高度、偏移等参数，识别多种异常或缺陷，如焊接不良、断裂、偏移等问题。通过及时发现和修复金线连接的问题，有助于提高封装芯片的质量和可靠性，降低芯片的不良率。
漏打线、打错线、飞线、打双线、线弧不良、金线残留、金线短路、焊球脱落、鱼尾脱落、焊球XY尺寸、焊球偏移、鱼尾XY尺寸、鱼尾偏移、有线无球、电容脱落、电容偏移、立碑、电容脏污、驱动C破损、驱动IC脱落、驱动IC脏污、感光芯片刮伤、感光芯片破损、感光芯片脏污。
Missed Bonds, Misplaced Bonds, Wire Fly, Double Bonds, Wire Arc Defects, WireResidue. Wire Short, Ball Lift. Tail Lift, Ball Offset, Tail Offset,Driver lC Damage, DriverIC Contamination.
独特的光学系统和检测算法，用于高速、高灵敏度的晶体缺陷检测和分类。
The unique optical system and detection algorithmsare employed for high-speed, high-sensitivity crystal defect detection andclassification.
2D&3D可选，3D测量Z向精度可达8um/ Optional2D &3D。
With 3D measurement achieving Z-axis accuracy up to 8um.
UPH：=5000pcs/h
尺寸/Size: L1000*W800*H1500mm
功率/Power：2KW，AC220V
重量Weight：800KG
AOI金线检测机用于检测封装芯片上的金线连接质量和准确性。
The AOl wire bonding inspection machine is used to detect the quality and accuracy of wire connections onpackaged chips.
使用高分辨率2D/3D相机和AI图像处理算法，对封装芯片上的金线连接进行快速、精确的检测和分析。能够检测金线的焊接情况、位置、高度、偏移等参数，识别多种异常或缺陷，如焊接不良、断裂、偏移等问题。
High-resolution 2D/3D cameras and Al image processing algorithms, the system performs rapid and precisedetection and analysis of wire connections on packaged chips. lt can detect parameters such as wire bondingcondition, position, height, and offset, and identify many anomalies or defects such as poor bonding, breakage or misalignment.
通过及时发现和修复金线连接的问题，有助于提高封装芯片的质量和可靠性，降低芯片的不良率。
By promptly identifying and repairing issues with wire connections, it helps to improve the guality and reliabilityof packaged chips, reducing the defect rate of the chips.
